The FTB150MP is a 6-inch CMP Tool designed for laboratory applications based on customer needs. It is compatible with various materials and features high-performance polishing units to achieve ultra-high wafer surface flatness. With its high cost-effectiveness, it serves as an ideal laboratory solution for high-precision process requirements.
Wafer Size
≤6 inches
Wafer Material
Si, SiC, GaN, etc.
Exquisite and compact with all functionalities
Dedicated to core R&D and applications in small-size fields
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