The TLT300MP is a 12-inch CMP equipment designed for laboratory applications based on current customer needs. This equipment features proprietary innovative technology, high-performance polishing units, and compatibility with both 8-inch and 12-inch wafers. It supports various materials and achieves ultra-high wafer surface flatness. With flexible process integration, it meets the requirements of high-precision manufacturing technologies.
Wafer Size
≤12 inches
Wafer Material
Si, SiC, GaN, etc.
Polishing Head
2
Platen
1
Meeting the diverse requirements of customers in different fields
Can be flexibly applied in R&D and small-scale production in all fields of the semiconductor industry
Multi-zone Polishing Head
Optional 8-inch/12-inch
Strong compatibility
Multi-zone Polishing Head Flexible Process Integration, meets Advanced Process Technology Requirements.
English
