BM310B is mainly applied to the appearance inspection of semiconductor discrete devices, integrated circuits and LEDs, and makes it possible to measure the dimensions of die, wire, AI strip, Clip, bond and detect their defects
Leadframe size
25-100mm
False call rate
≤0.05%
Precision measurement and detection
Gain customer recognition for high-precision detection performance and reliable automation integration
Excellent accuracy
Inspection accuracy ±3μm@3σ
High efficiency
≥30K for DFN products
Strong compatibility
Support the inspection of Au/Cu/Al wire products; serve semiconductor and LED industries
Outstanding reliability
AI algorithms help to reach a false call rate of ≤0.05%
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