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Semiconductor Products

Hybrid Aluminum Wedge Bonder

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B307A Hybrid Wedge Bonder is a multifunction, highly stable wedge bonder that provides efficient and high-yield bonding for automotive-grade and industrial modules.
  • Al Wire

    4~20mil 

  • Al Ribbon

    20*4mil~80*10mil

The Hybrid Wedge Bonder is primarily used for IGBU modules, and extends to applications such as laser modules and charging pile modules. The equipment can meet the process requirements for Al wire, Al power ribbon, Cu wire, and Cu power ribbon. The bondhead can be quickly switched within 60 minutes, ensuring high stability for the customer.
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